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"Whether you're
molding fiberglass boats, RTM auto parts, epoxy recreational equipment, or rubber hoses and gaskets, there's an XTEND semi-permanent release that's exactly right for your application."


XTEND semi-permanent releases are reactive resin solutions designed to cross-link and cure
on the mold surface, offering superior durability and extended release performance.


XTEND Semi-Permanent Releases:

> out-perform the competition

> leave no residue on the molded part

> cost less than similar releases

> available in water or solvent-based formulations

> compatible with all types of resin/rubber

> original chemistry - excellent for all processes


 Product #

 Used for Application Technique/
Application Temp
Type of Molds  Resin or Rubber Process Temp.

 Solvent-Based Semi-Permanent Mold Releases

 

800

Open Molding
Class "A Finishes
Cultured Marble

Wipe on / Ambient Temperature or Higher (<300ºF / 148ºC)

No Aluminum

All Except Silicone & Cyanate Esters

 <400ºF / 200ºC

 802

Like 800, but Quicker Evaporation

Wipe On or Spray On / Ambient Temperature

No Aluminum

All Except Silicone Cyanate Esters

 <400ºF / 200ºC

 19 HG

Closed Molding - RTM
Higher Gloss; Less Buildup Than 19W

 Wipe On Warm Molds (130-150ºF/ 55-65ºC)

All Mold Surfaces

All Except Silicone

 <400ºF / 200ºC

19 SAM Open Molding Solid Surface        

 19IT

 Spray on - No Wiping Required, High Gloss

 Spray On - Ambient

All Mold Surfaces

All Except Silicone

 <400ºF / 200ºC

 19RM

 Less Cosmetic than 800 Series
Excellent Slip, Quick Drying /Curing

 Wipe On - Ambient

All Mold Surfaces

All Except Silicone

 <400ºF / 200ºC

 19W

Closed Molding - RTM
SMC / BMC; High Slip Rim

Wipe On Warm Molds (130-150ºF/ 55-65ºC)

All Mold Surfaces 

All Except Silicone

<400ºF / 200ºC

 20RP

For High Temperature Molding
(up to 1000ºF/ 537ºC) Especially for
Roto-Molding

Wipe On / Spray On Ambient Temperature or Higher

All Mold Surfaces

 No Phenolics

up to 1000ºF/ 537ºC

 21

For High Temperature Molding - No Xylene (up to 600ºF/ 315ºC)

Wipe On / Spray On Ambient Temperature or Higher

All Mold Surfaces

 No Phenolics

up to 600ºF/ 315ºC

 Water-Based Semi-Permanent
 Mold Releases

 
 Product #  Used For Application Technique/
Application Temp
 Type of Molds  Resin or Rubber  Process Temp.

W-120

Hot Pressing Applications
Hybrid Fluoropolymer Release
May be Diliuted

Spray On Ambient or Higher

All Mold Surfaces

Most

 <400ºF / 200ºC

W-3201

Hot Pressing Applications
Fluoropolymer Release

Spray On Warm-Hot Molds
(180ºF/ 80ºC)

All Mold Surfaces

All Including Silicone

 <400ºF / 200ºC

W-3202

Hot Pressing Applications
Fluoropolymer Release

Spray On At Ambient Temperature

All Mold Surfaces

All Including Silicone

 <400ºF / 200ºC

W-3211

Hot Pressing Applications Especially Suitable for Peroxide Cured Rubbers

Spray On Warm-Hot Molds
(180ºF/ 80ºC)

All Mold Surfaces

All Including Silicone

 <400ºF / 200ºC

W-4002

For High Temperature Molding (up to 1000ºF/ 537ºC)

Spray On Ambient or Higher (up to 200ºF/ 94ºC)

All Mold Surfaces

All Except Silicone.

up to 1000ºF/ 537ºC

 W-7200

Epoxy & Epoxy pre-preg

Spray On Ambient or Higher (up to 200ºF/ 94ºC)

 Steel

All Except Silicone

 <400ºF / 200ºC

W-7500 Series

Urethanes & Elastomers

Spray On Ambient or Higher (up to 180ºF/ 80ºC)

All Mold Surfaces

All Except Silicone

 <400ºF / 200ºC

W-7800 Series

Epoxy. Also, Polyester, Phenolic
& Epoxy Pre-Preg

Spray On Ambient or Higher (up to 180ºF/ 80ºC)

All Mold Surfaces

All Except Silicone

 <400ºF / 200ºC

 Sealers

 S-19A

Quick Drying Sealer, Excellent Finish

 Wipe On / Ambient

All Mold Surfaces

All Except Silicone

 <400ºF / 200ºC

 Cleaners & Strippers

CX-70

Interim Cleaner for Semi-Permanent Releases

For Ambient Application or up to 130ºF / 55ºC

 

 

 

CX-WDS

Water-based stripper for FRP molds

For Ambient Application or Higher

 

   

CX-95

Especially For Removal of Styrene Buildup & Scumming

Apply to Warm Molds Up to 200ºF / 94ºC

     
CX-91 Especially for Removal of Styrene Buildup and Scumming        

CX-200HS

Removes Semi-Permanent Releases

For Ambient Application or up to 130ºF / 55ºC